Gained share in fastest growing segments of the assembly equipment market:įlip chip and multi module die attach and ultra thin molding for advanced packaging applications Increasing engineering, production and logistics activities in AsiaīE Semiconductor achieves highest growth (56%) among top assembly equipmentīesi Has Gained Market Share In Its Addressable Markets
Transferred to Besi AustriaĢ006-09 Standard packaging and certain die bonding systems transferred to MalaysiaĢ007-09 Dutch tooling & Hungarian die bonding transferred to AsiaĢ003-12 Malaysian system and Chinese tooling capacity expansion.Ģ013 Soft solder DB transferred to MalaysiaĢ006-14 Asian headcount increased from 34% to 59%Ģ015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore Plating unit rationalizedĢ014: US die sorting operations rationalized.
Headcount and product line restructuringĢ012 : 8.3 million cost savings.
Semi Packaging Tech Seminar June 18th, Vila do Conde - PortugalĢ006 Dragon I complete: 6 million cost savingsĢ008 Dragon II complete: 15 million cost savingsĢ010 Plan: 7.0 million cost savings.
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